Large-Scale 3D Chips: Challenges and Solutions for Design Automation, Testing, and Trustworthy Integration
Released on J-STAGE: August 02, 2017 |
Volume 10
Pages 45-62
Johann Knechtel, Ozgur Sinanoglu, Ibrahim (Abe) M. Elfadel, Jens Lienig, Cliff C. N. Sze